Samsung VP-D310 Spezifikationen Seite 338

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Seitenansicht 337
13-338 | OWNER’S GUIDE
Parameter DAQP-BRIDGE-B (revision 2)
RS-485 interface: Yes
TEDS: Supported TEDS chips Hardware support for TEDS (Transducer Electronic Data Sheet) DS2406, DS2430A, DS2432, DS2433
MSI support: Automatic MSI-BR-TH-x support
Power supply voltage: ±9 VDC (±1 %)
Power consumption: Typ. 1 W @ 350 Ω, 1.3 W @ 120 Ω (both full bridge @ 5 VDC excitation) Max: 2 W (depending on sensor)
1) 4-wire 1⁄4 bridge or ±0.5 mV input range will limit the bandwidth to 30 kHz
Module Pin-outs
CAUTION: The sensor shield can be connected to either pin 4 (SUB-D version only) or the housing of the 9-pin
SUB-D / 8-pin LEMO connector, depending on your application.
Full bridge signal connection
6-wire sensor connection 4-wire sensor connection
Sense leads (SUB-D: pin 3 and 6; LEMO: pin 5 and 6) MUST be connected!
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