Samsung MMCRE28G5MXP-0VB00 Datenblatt PDF herunterladen (Seite 9)

JANUARY 2009

SDRAM COMPONENTS

Density Organization Part Number # Pins - Package Speed (Mbps) Refresh Remarks

64Mb

8Mx8 K4S640832N-UC(75)000 54-TSOP 133 4K K-die changing to N-die

4Mx16 K4S641632N-UC(L)(75/60)000 54-TSOP 133/143/166 4K K-die changing to N-die

128Mb

16Mx8 K4S280832K-UC(L)(75)000 54-TSOP 133 4K I-die changing to K-die

8Mx16 K4S281632K-UC(L)(75/60)000 54-TSOP 133/166 4K I-die changing to K-die

256Mb

64Mx4 K4S560432J-UC(L)(75)000 54-TSOP 133 8K H-die changing to J-die

32Mx8 K4S560832J-UC(L)(75)000 54-TSOP 133 8K H-die changing to J-die

16Mx16 K4S561632J-UC(L)(75/60)000 54-TSOP 133/166 8K H-die changing to J-die

512Mb

128Mx4 K4S510432D-UC(L)(75)000 54-TSOP 133 8K

64Mx8 K4S510832D-UC(L)(75)000 54-TSOP 133 8K

32Mx16 K4S511632D-UC(L)(75)000 54-TSOP 133 8K

NOTES: L = Commercial Temp., Low Power

For industrial temperature, check with SSI Marketing

Banks: 4

All products are lead free

Voltage: 3.3V

Speed: PC133 (133MHz CL=3/PC100 CL2)

www.samsung.com/semi/dram

DDR,SDRAM&RDRAM

RDRAM COMPONENTS

Density Organization Part Number Speed (Mbps) # Pins - Package Refresh

288M x18 K4R881869I-DC(M8/T9) 800/1066 92-FBGA 16K/32ms

NOTES: Voltage: 2.5 V

All products are lead free

DRAM

DDR SDRAM COMPONENTS

Density Organization Part Number # Pins - Package Speed (Mbps) Notes

256Mb

64Mx4 K4H560438J-LCB3/B0 66-TSOP 266/333 Halogen -free

32Mx8 K4H560838J-LCCC/B3 66-TSOP 333/400 Halogen -free

16Mx16 K4H561638J-LCCC/B3 66-TSOP 333/400 Halogen -free

512Mb

128Mx4

K4H510438F-LCB3/B0 66-TSOP 266/333 Halogen -free

K4H510438F-HCCC/B3 60-FBGA 333/400 Halogen -free

64Mx8

K4H510838F-LCCC/B3 66-TSOP 333/400 Halogen -free

K4H510838F-HCCC/B3 60-FBGA 333/400 Halogen -free

32Mx16 K4H511638F-LCCC/B3 66-TSOP 333/400 Halogen -free

128Mb 8Mx16 K4H281638L-LCCC/CD 66-TSOP 400/500 Halogen -free

NOTES: B0 = DDR266 (133MHz @ CL=2.5)

A2 = DDR266 (133MHz @ Cl=2)

B3 = DDR333 (166MHz @ CL=2.5)

CC = DDR400 (200MHz @ CL=3)

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