Samsung MIM-B17C Spezifikationen PDF herunterladen (Seite 13)

Disassembly and Reassembly

3-4 Samsung Electronics

No Parts Procedure Remark

10) Unscrew 2 fixing screws at red circle.

11) Pick up the upper cover.

Be careful not to damage LED on sub board.

12) As the shown picture, detach the cable between

main and LCD board.

BACnet Gateway_E_32400A(1)_1.indd 4 2010-05-17 �� 10:34:45

1 2 ... 8 9 10 11 12 13 14 15 16 17 18 ... 66 67

BACnet Gateway 1
Contents 2
1. Precautions 4
2. Product Specifications 5
2-2. Product Specifications 6
2-3. System Organization 7
2-4. Main Function 8
2-5 Samsung Electronics 9
3. Disassembly and Reassembly 10
3-2 Samsung Electronics 11
Samsung Electronics 3-3 12
3-4 Samsung Electronics 13
Samsung Electronics 3-5 14
3-6 Samsung Electronics 15
Samsung Electronics 3-7 16
4. Program Update 17
4-1. OS Update 18
4-3 Samsung Electronics 19
Samsung Electronics 4-4 20
4-5 Samsung Electronics 21
Samsung Electronics 4-6 22
4-7 Samsung Electronics 23
Samsung Electronics 4-8 24
4-9 Samsung Electronics 25
Samsung Electronics 4-10 26
4-11 Samsung Electronics 27
Samsung Electronics 4-12 28
5. Troubleshooting 29
Samsung Electronics 5-2 30
5-3 Samsung Electronics 31
Samsung Electronics 5-4 32
5-5 Samsung Electronics 33
Samsung Electronics 5-6 34
5-7 Samsung Electronics 35
Samsung Electronics 5-8 36
5-9 Samsung Electronics 37
Samsung Electronics 5-10 38
5-11 Samsung Electronics 39
Samsung Electronics 5-12 40
5-13 Samsung Electronics 41
Samsung Electronics 5-14 42
5-15 Samsung Electronics 43
Samsung Electronics 5-16 44
6-1 Samsung Electronics 45
 Parts List 46
1 2 3 4 5 6 7 8 9 10 11 47
7-2. Display Board 48
7-3. Sub Board 49
8. Wiring Diagram 50
9. Schematic Diagram 51
Main Board(cont.) 52
)BM652( MARDS RDD eliboM 53
HSALF DNAN 2 x BM215 54
REDOCED TCELES-PIHC 55
)1( slennahC 584-SR 57
)2( slennahC 584-SR 58
)3( slennahC 584-SR 59
MOCIM TESER 62
DEL GUBED 63
9-2. Display Board 65
ECAFRETNI OD/ID 66
ECAFRETNI )B(BUS dna NIAM 66
Printed in Korea 67
Code No. DB98-32400A(1) 67

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