Samsung MIM-B17C Spezifikationen PDF herunterladen (Seite 14)

Samsung Electronics 3-5

3-2. Sub board Disassembly and Reassembly

No Parts Procedure Remark

1 Common 1) As shown picture, detach the connector pulling

upper direction.

2) Unscrew 4 fixing screw on sub board.

(Use +Screw Driver)

3) Detach the sub board from BACnet Gateway.

BACnet Gateway_E_32400A(1)_1.indd 5 2010-05-17 �� 10:34:46

1 2 ... 9 10 11 12 13 14 15 16 17 18 19 ... 66 67

BACnet Gateway 1
Contents 2
1. Precautions 4
2. Product Specifications 5
2-2. Product Specifications 6
2-3. System Organization 7
2-4. Main Function 8
2-5 Samsung Electronics 9
3. Disassembly and Reassembly 10
3-2 Samsung Electronics 11
Samsung Electronics 3-3 12
3-4 Samsung Electronics 13
Samsung Electronics 3-5 14
3-6 Samsung Electronics 15
Samsung Electronics 3-7 16
4. Program Update 17
4-1. OS Update 18
4-3 Samsung Electronics 19
Samsung Electronics 4-4 20
4-5 Samsung Electronics 21
Samsung Electronics 4-6 22
4-7 Samsung Electronics 23
Samsung Electronics 4-8 24
4-9 Samsung Electronics 25
Samsung Electronics 4-10 26
4-11 Samsung Electronics 27
Samsung Electronics 4-12 28
5. Troubleshooting 29
Samsung Electronics 5-2 30
5-3 Samsung Electronics 31
Samsung Electronics 5-4 32
5-5 Samsung Electronics 33
Samsung Electronics 5-6 34
5-7 Samsung Electronics 35
Samsung Electronics 5-8 36
5-9 Samsung Electronics 37
Samsung Electronics 5-10 38
5-11 Samsung Electronics 39
Samsung Electronics 5-12 40
5-13 Samsung Electronics 41
Samsung Electronics 5-14 42
5-15 Samsung Electronics 43
Samsung Electronics 5-16 44
6-1 Samsung Electronics 45
 Parts List 46
1 2 3 4 5 6 7 8 9 10 11 47
7-2. Display Board 48
7-3. Sub Board 49
8. Wiring Diagram 50
9. Schematic Diagram 51
Main Board(cont.) 52
)BM652( MARDS RDD eliboM 53
HSALF DNAN 2 x BM215 54
REDOCED TCELES-PIHC 55
)1( slennahC 584-SR 57
)2( slennahC 584-SR 58
)3( slennahC 584-SR 59
MOCIM TESER 62
DEL GUBED 63
9-2. Display Board 65
ECAFRETNI OD/ID 66
ECAFRETNI )B(BUS dna NIAM 66
Printed in Korea 67
Code No. DB98-32400A(1) 67

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